Home / Inspect What the Eye Can’t See — PCB & Electronics Quality with X-ray and CT
Electronics manufacturing is shifting toward higher density, smaller packages, and faster production cycles; making hidden defects more likely and more costly. Failures caused by voiding, bridging, head-in-pillow, lifted leads, and insufficient solder fill often pass visual inspection but can lead to early field returns.
That’s why Non-Destructive Testing (NDT)—especially X-ray and CT—is critical for electronics quality. It enables manufacturers to inspect internal solder joints, verify connectivity, detect void patterns, and confirm process stability without damaging the PCB.
Fast, accurate reel counting (even 01005) to prevent inventory mismatch, line stoppages, and planning errors.
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Detect hidden solder defects like BGA voids, bridging, head-in-pillow indicators, and PTH fill issues without damaging the PCB.
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Move beyond 2D ambiguity. CT separates overlaps and confirms root cause with layer-by-layer slices and volumetric reconstruction.
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For package-level analysis and micro-defect detection where standard X-ray is not enough—layer-by-layer CT slices for void morphology, cracks, delamination, and internal connectivity validation.
Sub-micron imaging for advanced electronics R&D and deep failure analysis
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